The future of high temperature interconnect

Microsemi Semiconductor Ltd

MicrosemiMicrosemi Semiconductor Ltd (formally Zarlink Semiconductor Ltd) is a multi national semiconductor company headquartered in the US. At the facility in Portskewett Monmouthshire, the team design, develop and manufacture advanced microelectronic technologies, miniaturisation, low power wireless communication, energy harvesting and high ambient temperature electronics. The site has extensive micro-packaging capabilities for medical, wireless, telecommunications and security customers.

Microsemi is a leading “system in package” component supplier to the electronics industry and has a proven track record in implementing new concepts developed under the FP6/7 umbrella and TSB funded collaborations.

Microsemi (as Zarlink) first joined the collaborative projects in 2003. Since then Microsemi has been involved with 7 EU projects and 5 TSB as well as managing projects using its integral industrial expertise and systems up to the value of €10M.

With over 20 years experience in micro-electronics assembly, focusing on miniaturisation through SIP packaging Microsemi is are well placed to understand the potential for new innovative product. For the past 4 years Microsemi (Zarlink) has been developing and qualifying high temperature packaging for product operating at 225oC ambient. Microsemi is currently the project coordinator for the €4M EU funded SOI-HITs project on 225 oC sensors.

Zarlink Bought by Microsemi Corp

In stage 1 of the proposal the legal name of the lead partner was given as Zarlink Semiconductor Ltd. Following the acquisition of Zarlink Corporation by Microsemi Corp and subsequent re-branding the legal name of Zarlink in the UK has changed to Microsemi Semiconductor Ltd. All other details remain unchanged.

Team Members:

Fiona Lambert Fiona Lambert graduated from Loughborough University in 2005 with an MEng in Electrical and Electronic Engineering. She joined Renishaw on their graduate employment scheme and spent a year gaining valuable insight into key areas of electronic design and manufacturing departments through Renishaw’s graduate introduction programme. She then spent three years supporting and improving Renishaw’s electronic production lines. Since moving to Microsemi, then Zarlink, in 2009 as a process engineer, she has spent five years, playing a key role in improving the production processes and managing the validation of critical new products for Microsemi’s medical OEM customers.
Since achieving the grade of Senior Engineer she has played a pivotal role in Microsemi multi-million £ die embedding programmes.  She is currently involved in collaborative research and development programmes as technical project lead for the £0.5M UK National project ELCOSINT.


Jo Postle  Jo graduated from University of South Wales in 2014 gaining an MBA specialising in business improvement and creativity to support her extensive work based experience.  Jo has over 15 years’ experience in project management and business improvement within the service and manufacturing industries.  Jo is the Business Improvement Project Lead at Microsemi and has worked for the organisation for 5 years developing robust and efficient processes for continued business improvement activities.  Jo has worked on and managed various EU and UK grant funded projects including Framework 7, Horizon 2020 and Innovate UK.